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dc.contributor.authorEkpu, Mathias
dc.contributor.authorOgbodo, Eugene A.
dc.contributor.authorNgobigha, Felix
dc.contributor.authorNjoku, Jude E.
dc.date.accessioned2022-11-07T17:30:02Z
dc.date.available2022-11-07T17:30:02Z
dc.date.issued2022-10-14
dc.identifier.citationEkpu , M , Ogbodo , E A , Ngobigha , F & Njoku , J E 2022 , ' Thermal Effect of Cylindrical Heat Sink on Heat Management in LED Applications ' , Energies , vol. 15 , no. 20 , 7583 . https://doi.org/10.3390/en15207583
dc.identifier.issn1996-1073
dc.identifier.urihttp://hdl.handle.net/2299/25875
dc.description© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https:// creativecommons.org/licenses/by/4.0/).
dc.description.abstractLight Emitting Diode (LED) applications are increasingly used in various microelectronic devices due to their efficient light generation. The miniaturisation of the LED and its integration into compact devices within the weight limit have resulted in excessive heat generation, and inefficient management of this heat could lead to the failure of the entire system. Passive and/or active heat sinks are used for dissipating heat from the system to the environment to improve performance. An ANSYS design modeller and transient thermal conditions were utilised in this study to design and simulate the LED system. The modeller performs its function by utilising the Finite Element Method (FEM) technique. The LED system considered in this work consists of a chip, thermal interface material, and a cylindrical heat sink. The thickness of the Cylindrical Heat Sink (CHS) fins used in the investigation is between 2 mm and 6 mm, whilst ensuring the mass of heat sinks is not more than 100 g. The input power of the LED chip is between 4.55 W and 25.75 W, as required by some original equipment manufacturers (OEMs). A mesh dependency study was carried out to ensure the results were synonymous with what can be obtained practically. The simulation results suggest that the power ratings did not affect the thermal resistance of the CHS. In addition, the thermal resistance increased with the increased thickness of the CHS fin. The efficiencies of the heat sink were found to increase with an increased thickness of the cylindrical fin and the accuracy between the calculated and simulated thermal efficiency ranges from 84.33% to 98.80%. Evidently, the CHS fin of 6 mm thickness is more efficient than the other CHS fins, as depicted in this study.en
dc.format.extent13
dc.format.extent6142381
dc.language.isoeng
dc.relation.ispartofEnergies
dc.subjectcylindrical heat sink
dc.subjectheat management
dc.subjectLED
dc.subjectthermal analysis
dc.subjecttransient condition
dc.subjectRenewable Energy, Sustainability and the Environment
dc.subjectBuilding and Construction
dc.subjectFuel Technology
dc.subjectEngineering (miscellaneous)
dc.subjectEnergy Engineering and Power Technology
dc.subjectEnergy (miscellaneous)
dc.subjectControl and Optimization
dc.subjectElectrical and Electronic Engineering
dc.titleThermal Effect of Cylindrical Heat Sink on Heat Management in LED Applicationsen
dc.contributor.institutionSchool of Physics, Engineering & Computer Science
dc.contributor.institutionDepartment of Pharmacy, Pharmacology and Postgraduate Medicine
dc.description.statusPeer reviewed
dc.identifier.urlhttp://www.scopus.com/inward/record.url?scp=85140653795&partnerID=8YFLogxK
rioxxterms.versionofrecord10.3390/en15207583
rioxxterms.typeJournal Article/Review
herts.preservation.rarelyaccessedtrue


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