Investigating Heat Transfer and Flow Characteristics under Different Wall Heating Conditions in Novel Micro Pin-Fin Heat Sinks

The escalating power density in electronic devices demands effective and sustainable heat dissipation solutions. Micro pin-fin designs offer potential enhancements to thermal management in electronic cooling. Consequently, this short paper numerically investigates heat transfer and flow characteristics in micro pin-fin heating under distinct wall heating conditions. The results indicate that the new scutoid design exhibits a commendable heat transfer coefficient of 3298 W/m²K, with the lowest pressure drop and operating base temperatures. Thus, the findings provide a foundation for future designs and efficient heat transfer strategies.