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        Copper Electrochemical Deposition in Macroporous Silicon Arrays for Through Silicon Via Applications

        Author
        Defforge, Thomas
        Coudron, Loic
        Gautier, Gael
        Grimal, Virginie
        Ventura, Laurent
        Tran Van, Francois
        Attention
        2299/10015
        Abstract
        The present paper deals with the realization of high conductivity through silicon via from macroporous silicon arrays. The pores were first etched by anodization into a hydrofluoric acid mixture. The high aspect ratio via were then filled by an optimized potentiostatic way involving a specific electrolyte with additives. The copper micro-wires were observed by SEM whereas XRD analysis enabled the determination of copper average grain size.
        Publication date
        2011
        Published in
        Procs 2011 IEEE Int Interconnect Technology Conference and 2011 Materials for Advanced Metallization
        Published version
        https://doi.org/10.1109/IITC.2011.5940336
        Other links
        http://hdl.handle.net/2299/10015
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