Copper Electrochemical Deposition in Macroporous Silicon Arrays for Through Silicon Via Applications
Author
Defforge, Thomas
Coudron, Loic
Gautier, Gael
Grimal, Virginie
Ventura, Laurent
Tran Van, Francois
Attention
2299/10015
Abstract
The present paper deals with the realization of high conductivity through silicon via from macroporous silicon arrays. The pores were first etched by anodization into a hydrofluoric acid mixture. The high aspect ratio via were then filled by an optimized potentiostatic way involving a specific electrolyte with additives. The copper micro-wires were observed by SEM whereas XRD analysis enabled the determination of copper average grain size.