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Copper Electrochemical Deposition in Macroporous Silicon Arrays for Through Silicon Via Applications

dc.contributor.authorDefforge, Thomas
dc.contributor.authorCoudron, Loic
dc.contributor.authorGautier, Gael
dc.contributor.authorGrimal, Virginie
dc.contributor.authorVentura, Laurent
dc.contributor.authorTran Van, Francois
dc.date.accessioned2013-02-14T08:30:13Z
dc.date.available2013-02-14T08:30:13Z
dc.date.issued2011
dc.identifier.citationDefforge , T , Coudron , L , Gautier , G , Grimal , V , Ventura , L & Tran Van , F 2011 , Copper Electrochemical Deposition in Macroporous Silicon Arrays for Through Silicon Via Applications . in Procs 2011 IEEE Int Interconnect Technology Conference and 2011 Materials for Advanced Metallization : (IITC/MAM) . Institute of Electrical and Electronics Engineers (IEEE) , pp. 1-3 , IEEE International Interconnect Technology Conference and Materials for Advanced Metallization (IITC/MAM) , Dresden , 8/05/11 . https://doi.org/10.1109/IITC.2011.5940336
dc.identifier.citationconference
dc.identifier.isbn978-1-4577-0502-1
dc.identifier.otherPURE: 679327
dc.identifier.otherPURE UUID: 2745d2e4-3307-400d-a8ce-9c1c83b0abf3
dc.identifier.otherWOS: 000299283100077
dc.identifier.otherScopus: 80052067170
dc.identifier.urihttp://hdl.handle.net/2299/10015
dc.description.abstractThe present paper deals with the realization of high conductivity through silicon via from macroporous silicon arrays. The pores were first etched by anodization into a hydrofluoric acid mixture. The high aspect ratio via were then filled by an optimized potentiostatic way involving a specific electrolyte with additives. The copper micro-wires were observed by SEM whereas XRD analysis enabled the determination of copper average grain size.en
dc.format.extent3
dc.language.isoeng
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)
dc.relation.ispartofProcs 2011 IEEE Int Interconnect Technology Conference and 2011 Materials for Advanced Metallization
dc.titleCopper Electrochemical Deposition in Macroporous Silicon Arrays for Through Silicon Via Applicationsen
dc.contributor.institutionMicrofluidics and Microengineering
dc.contributor.institutionCentre for Engineering Research
dc.contributor.institutionCentre for Research in Biodetection Technologies
dc.contributor.institutionSchool of Physics, Engineering & Computer Science
dc.contributor.institutionDepartment of Engineering and Technology
dc.contributor.institutionBioEngineering
dc.contributor.institutionMicro Electro-Mechanical Systems
dc.contributor.institutionCentre for Future Societies Research
rioxxterms.versionofrecordhttps://doi.org/10.1109/IITC.2011.5940336
rioxxterms.typeOther
herts.preservation.rarelyaccessedtrue


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