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dc.contributor.authorDefforge, Thomas
dc.contributor.authorCoudron, Loic
dc.contributor.authorGautier, Gael
dc.contributor.authorGrimal, Virginie
dc.contributor.authorVentura, Laurent
dc.contributor.authorTran Van, Francois
dc.date.accessioned2013-02-14T08:30:13Z
dc.date.available2013-02-14T08:30:13Z
dc.date.issued2011
dc.identifier.citationDefforge , T , Coudron , L , Gautier , G , Grimal , V , Ventura , L & Tran Van , F 2011 , Copper Electrochemical Deposition in Macroporous Silicon Arrays for Through Silicon Via Applications . in Procs 2011 IEEE Int Interconnect Technology Conference and 2011 Materials for Advanced Metallization : (IITC/MAM) . IEEE , pp. 1-3 , IEEE International Interconnect Technology Conference and Materials for Advanced Metallization (IITC/MAM) , Dresden , 8/05/11 . DOI: 10.1109/IITC.2011.5940336en
dc.identifier.citationconferenceen
dc.identifier.isbn978-1-4577-0502-1
dc.identifier.otherPURE: 679327
dc.identifier.otherPURE UUID: 2745d2e4-3307-400d-a8ce-9c1c83b0abf3
dc.identifier.otherWOS: 000299283100077
dc.identifier.otherScopus: 80052067170
dc.identifier.urihttp://hdl.handle.net/2299/10015
dc.description.abstractThe present paper deals with the realization of high conductivity through silicon via from macroporous silicon arrays. The pores were first etched by anodization into a hydrofluoric acid mixture. The high aspect ratio via were then filled by an optimized potentiostatic way involving a specific electrolyte with additives. The copper micro-wires were observed by SEM whereas XRD analysis enabled the determination of copper average grain size.en
dc.format.extent3en
dc.language.isoeng
dc.publisherIEEE
dc.relation.ispartofProcs 2011 IEEE Int Interconnect Technology Conference and 2011 Materials for Advanced Metallizationen
dc.rightsen
dc.titleCopper Electrochemical Deposition in Macroporous Silicon Arrays for Through Silicon Via Applicationsen
dc.contributor.institutionSchool of Engineering and Technologyen
dc.contributor.institutionScience & Technology Research Instituteen
dc.contributor.institutionMicrofluidics and Microengineeringen
dc.contributor.institutionCentre for Engineering Researchen
dc.identifier.doihttps://doi.org/10.1109/IITC.2011.5940336
dc.relation.schoolSchool of Engineering and Technology
herts.preservation.rarelyaccessedtrue


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