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    • Copper Electrochemical Deposition in Macroporous Silicon Arrays for Through Silicon Via Applications 

      Defforge, Thomas; Coudron, Loic; Gautier, Gael; Grimal, Virginie; Ventura, Laurent; Tran Van, Francois (Institute of Electrical and Electronics Engineers (IEEE), 2011)
      The present paper deals with the realization of high conductivity through silicon via from macroporous silicon arrays. The pores were first etched by anodization into a hydrofluoric acid mixture. The high aspect ratio via ...